Microsystems Research-to-Development-to-Applications At Sandia National Laboratories
Marion Scott, PhD,
Director, Microsystems Science, Technology & Components Center,
Sandia National Laboratories, Albuquerque, NM
From the invention of the laminar-flow cleanroom to pioneering work on CMOS to the development of the world's most advanced surface micromachining technology to the chem-lab-on-a-chip, Sandia has been involved in innovative research-to-development-to application in microelectronics and microsystems. This talk will provide a survey of the broad range of microsystems activities at Sandia. Sandia has major capabilities in radiation-hardened microelectronics, micromachining, compound semiconductors, reliability, failure analysis and packaging. These capabilities are applied in a number of important application areas including custom microelectronics, RF, chemical and biological sensing. Sandia is currently undergoing a massive upgrade focused on developing a capability that integrates advanced fabrication with advanced simulation to provide the capability to rapidly and affordably development advanced microsystems in the national interest.
MARION W. SCOTT received his Ph.D. degree in Electrical Engineering from Southern Methodist 1979. He joined the LTV Corporation in 1979 where he worked on laser radar and optical imaging systems. In 1986, he joined Sandia National Laboratories Optoelectronic Components Group, where he worked on range imaging laser radar. He invented a scannerless range imager that has been applied to wing inspection on the space shuttle. In 1994, he became the Sensor Programs Manager in the Microelectronics and Photonics Center at Sandia. He has initiated projects in chemical and physical state sensing, including a micro-chemical analysis system; weapon state-of-health monitoring; bio-micro fuel cells; and miniature radars. In 2001, he was named Director of Microsystems, Science, Technology and Components. This center is now a 150M enterprise that encompasses microelectronics, photonics, MEMS, RF and microwave components, and advanced packaging.