Dissertation Defense

Low Temperature Wafer Level Vacuum Packaging Using Au-Si Eutectic Bonding and Localized Heating

Name: Low Temperature Wafer Level Vacuum Packaging Using Au-Si Eutectic Bonding and Localized Heating
Start: 2007-12-07T14:30:00-05:00
End: 2007-12-07T14:30:00-05:00

Jay MitchellMechanical Engineering

WHEN:

Friday, December 7, 2007 @ 2:30 pm
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Dissertation Defense

Low Temperature Wafer Level Vacuum Packaging Using Au-Si Eutectic Bonding and Localized Heating

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