Electrical Feedthrough in Glass for Wafer Level Packaging and Arrayed MEMS

Professor Masayoshi Esashi
New Industry Creation Hatchery Center (NICHe),
Tohoku University, Sendai, 980-8579, Japan

ABSTRACT:
Wafer level packaging shown in Fig.1 has been made by bonding a Pyrex glass having many electrical feedthroughs and a silicon wafer and applied for integrated capacitive pressure sensor, electrostatically levitated rotational gyro, MEMS relay and so on. Not only low cost and small size but also high reliability can be achieved.

The interconnection between arrayed MEMS and IC chip can be made using a high density electrical feedthrough. This technology has been applied for wafer probing head, multi-probe data storage and electron field emitter array for multi-column electron beam lithography. This approach called SIP (System In Package) MEMS enables to fabricate the MEMS chip and IC chip separately and simplify the fabrication process.

BIO:
Masayoshi Esashi was born in Sendai,Japan,on January 30,1949. He received the B.E. degree in electronic engineering in 1971 and the Doctor of Engineering degree in 1976 at Tohoku University.

From 1976 to 1981, he served as a research associate at the Department of Electronic Engineering, Tohoku University and he was an associate professor from 1981 to 1990. He has been a professor at the Department of Mechatronics and Precision Engineering from 1990 to 1998. Since 1998 he has been a professor at the New Industry Creation Hatchery Center (NICHe) in Tohoku University. He was a director of the Venture Business Laboratory in Tohoku University (1995<1998). He has been a President of Sensor-Micromachine Society in Institute of Electrical Engineers in Japan (2002-2003). He has been a collaboration cordinator for Sendai city since 2004. He served as a general co-chairman of the 4th IEEE MEMS in 1991 held in Nara, Japan and also as a general chairman of the Transducers 99 held in Sendai, Japan. He has been studying microsensors and integrated micro systems fabricated with micromachining.